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Wylie CPU Underfill BGA Epoxy Adhesive for Apple iPhone

Name: Wylie CPU Underfill BGA Epoxy Adhesive for Apple iPhone
Brand: Wylie
SKU: 336269
Price: 1466 ISK
Availability: OutOfStock

ID: 336269

EAN: 107082004893

1,466 kr

Taxes included. Shipping calculated at checkout.

Warranty: 6 months

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Wylie CPU Underfill BGA Epoxy Adhesive

for Apple iPhone

Wylie Epoxy BGA Underfill CPU Underfill Epoxy Adhesive is the ideal solution for professional repairs of Apple iPhone components.

Specifically designed to provide a robust and durable support, this adhesive is used to strengthen the bonds between the BGA chipset and the PCB (motherboard),

reducing the risk of damage caused by mechanical shock or temperature variations. An essential product for GSM repair technicians,

ensuring performance and reliability in high precision interventions.